The power module packaging market is booming, projected to reach $2.5B in 2025 with a 9.78% CAGR. Driven by EVs, renewable energy, and miniaturization, this report analyzes market trends, segmentation (substrate, die attach, etc.), key players (Toshiba, Infineon), and regional growth (North America, Asia-Pacific). Discover key insights and future forecasts for this rapidly expanding industry.
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