The advanced packaging market is booming, projected to reach $32.64B in 2025 with a 6.63% CAGR through 2033. Driven by AI, 5G, and IoT, this report analyzes market trends, key players (Samsung, Intel, TSMC), and regional growth, providing valuable insights for industry stakeholders. Explore flip chip, embedded die, and WLP technologies shaping the future of electronics.
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